Quantum-dot single-photon source on a CMOS silicon photonic chip integrated using transfer printing
Quantum-dot single-photon source on a CMOS silicon photonic chip integrated using transfer printing
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DOI：
10.1063/1.5087263
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发表时间：
2019-03-01
期刊：
影响因子：
5.6
通讯作者：
Arakawa, Yasuhiko
中科院分区：
文献类型：
--
作者：
Katsumi, Ryota;Ota, Yasutomo;Arakawa, Yasuhiko
硅光子学与成熟的互补金属氧化物半导体（CMOS）技术兼容，是实现大规模光子集成电路（PIC）的强大平台。利用硅基PIC进行量子光子信息处理（或所谓的硅量子光子学）为大规模量子应用提供了一条有前途的途径。对于可扩展的硅量子PIC的开发，一个主要的挑战是集成确定性地发射单光子的硅上量子光源。在这方面，使用外延InAs/GaAs量子点（QD）是一个非常有前途的方法，因为它们的确定性单光子发射的能力，具有高纯度和不可扩展性。然而，所需的混合集成是固有的困难，往往缺乏与CMOS工艺的兼容性。在这里，我们展示了集成在由CMOS代工厂加工的玻璃包层硅光子波导上的QD单光子源。混合集成使用转印进行，这使我们能够以简单的拾取和放置方式集成异构光学元件，从而在整个CMOS工艺完成后进行组装。我们观察到单光子发射的集成量子点和其有效的耦合到硅波导。我们基于转印的方法与CMOS后端工艺完全兼容，因此将为实现利用CMOS技术的大规模量子PIC提供可能性。(C)2019年作者。
Silicon photonics is a powerful platform for implementing large-scale photonic integrated circuits (PICs) because of its compatibility with mature complementary-metal-oxide-semiconductor (CMOS) technology. Exploiting silicon-based PICs for quantum photonic information processing (or the so-called silicon quantum photonics) provides a promising pathway for large-scale quantum applications. For the development of scalable silicon quantum PICs, a major challenge is integrating on-silicon quantum light sources that deterministically emit single photons. In this regard, the use of epitaxial InAs/GaAs quantum dots (QDs) is a very promising approach because of their capability of deterministic single-photon emission with high purity and indistinguishability. However, the required hybrid integration is inherently difficult and often lacks the compatibility with CMOS processes. Here, we demonstrate a QD single-photon source integrated on a glass-clad silicon photonic waveguide processed by a CMOS foundry. Hybrid integration is performed using transfer printing, which enables us to integrate heterogeneous optical components in a simple pick-and-place manner and thus assemble them after the entire CMOS process is completed. We observe single-photon emission from the integrated QD and its efficient coupling into the silicon waveguide. Our transfer-printing-based approach is fully compatible with CMOS back-end processes and thus will open the possibility for realizing large-scale quantum PICs that leverage CMOS technology. (C) 2019 Author(s).