An integrated algorithm for 3D-IC TSV assignment
An integrated algorithm for 3D-IC TSV assignment
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DOI：
10.1145/2024724.2024873
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发表时间：
2011-06
期刊：
影响因子：
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通讯作者：
Xiaodong Liu;Yifan Zhang;G. Yeap;Xuan Zeng
中科院分区：
文献类型：
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作者：
Xiaodong Liu;Yifan Zhang;G. Yeap;Xuan Zeng
硅通孔（TSV）是一种能够垂直集成硅管芯以形成单个3D-IC堆叠的技术。本文提出了一个实用的模型，用于堆叠芯片的三维网络的TSV分配问题。我们提出了文献中的第一个工作，证明了一般的3D-IC TSV分配问题，两个以上的模具是NP-完全的。提出了一种结合最短路径、二分匹配、最小费用最大流和最优线性规划的高效启发式算法。实验结果表明，我们的流程实现了良好的质量的结果（98%的最优解）与合理的运行时间相比，相关的作品。
Through-Silicon Via (TSV) is a technology that enables vertical integration of silicon dies forming a single 3D-IC stack. In this paper, a practical model is proposed for the TSV assignment problem of the stacked-die 3D nets. We present the first work in the literature to prove that the general 3D-IC TSV assignment problem with more than two dies is NP-complete. An efficient heuristic algorithm that combines Shortest Path, Bipartite Matching, Min-cost Max-flow and Integer Linear Programming is developed. Experimental results demonstrate that our flow achieves good quality of results (within 98% of the optimal solution) with reasonable run-time compared to related works.