Ultrastiff Biobased Epoxy Resin with High Tg and Low Permittivity: From Synthesis to Properties

Ultrastiff Biobased Epoxy Resin with High Tg and Low Permittivity: From Synthesis to Properties
复制标题

DOI:
10.1021/acssuschemeng.6b00479
复制
发表时间:
2016-04
影响因子:
8.4
通讯作者:
Jintao Wan;Jianqing Zhao;B. Gan;Cheng Li;J. Molina-Aldareguia;Ying Zhao;Ye-Tang Pan;De‐yi Wang-De‐yi-W
Jintao Wan;Jianqing Zhao;B. Gan;Cheng Li;J. Molina-Aldareguia;Ying Zhao;Ye-Tang Pan;De‐yi Wang-De‐yi-W
中科院分区:
化学1区
文献类型:
--
作者:
Jintao Wan;Jianqing Zhao;B. Gan;Cheng Li;J. Molina-Aldareguia;Ying Zhao;Ye-Tang Pan;De‐yi Wang-De‐yi-W

文献摘要

被引文献

相似文献

获得具有更好的热机械性能(如玻璃化转变温度Tg和储存模数)、力学性能和介电性能与双酚A环氧树脂(DGEBA)相似甚至更好的生物基环氧树脂对于许多应用是至关重要的,但仍然是一个巨大的挑战。在这里,我们开发了一种新的丁香酚基环氧单体(TEU-EP),具有支化拓扑结构和非常丰富的生物基保留率(80wt%)。3,3‘-二氨基二苯基砜(33DDS)能很好地固化TEU-EP,生成的TEU-EP/33DDS体系可视为“单一”的环氧组分,在较高的加工温度下表现出足够的反应活性。重要的是,与DGEBA/33DDS相比,TEU-EP/33DDS的玻璃化转变温度、杨氏模量和硬度分别提高了33℃、39%和55%,并表现出更好的蠕变抗力和尺寸稳定性。TEU-EP/33DDS还具有较低的介电常数、介电损耗因子和可燃性,且具有较高的弹性系数。
Harvesting biobased epoxy resins with improved thermomechanical properties (e.g., glass transition temperature Tg and storage modulus), mechanical and dielectric similar and even superior to that of bisphenol A epoxy resin (DGEBA) is vital to many applications, yet remains a substantial challenge. Here we develop a novel eugenol-based epoxy monomer (TEU-EP) with a branched topology and a very rich biobased retention (80 wt %). TEU-EP can be well cured by 3,3′-diaminodiphenyl sulfone (33DDS) and the resultant TEU-EP/33DDS system can be considered as a “single” epoxy component, exhibiting adequate reactivity at high processing temperatures. Importantly, compared with DGEBA/33DDS, TEU-EP/33DDS achieves a 33 °C, 39% and 55% increment in the glass transition temperature, Young’s modulus, and hardness, respectively, and shows the improved creep resistance and dimensional stability. TEU-EP/33DDS is also characterized by the considerably reduced permittivity, dielectric loss factor, and flammability with high yie...