Ultrastiff Biobased Epoxy Resin with High Tg and Low Permittivity: From Synthesis to Properties
Ultrastiff Biobased Epoxy Resin with High Tg and Low Permittivity: From Synthesis to Properties
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DOI:
10.1021/acssuschemeng.6b00479
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发表时间:
2016-04
影响因子:
8.4
通讯作者:
Jintao Wan;Jianqing Zhao;B. Gan;Cheng Li;J. Molina-Aldareguia;Ying Zhao;Ye-Tang Pan;De‐yi Wang-De‐yi-W
中科院分区:
文献类型:
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作者:
Jintao Wan;Jianqing Zhao;B. Gan;Cheng Li;J. Molina-Aldareguia;Ying Zhao;Ye-Tang Pan;De‐yi Wang-De‐yi-W
Harvesting biobased epoxy resins with improved thermomechanical properties (e.g., glass transition temperature Tg and storage modulus), mechanical and dielectric similar and even superior to that of bisphenol A epoxy resin (DGEBA) is vital to many applications, yet remains a substantial challenge. Here we develop a novel eugenol-based epoxy monomer (TEU-EP) with a branched topology and a very rich biobased retention (80 wt %). TEU-EP can be well cured by 3,3′-diaminodiphenyl sulfone (33DDS) and the resultant TEU-EP/33DDS system can be considered as a “single” epoxy component, exhibiting adequate reactivity at high processing temperatures. Importantly, compared with DGEBA/33DDS, TEU-EP/33DDS achieves a 33 °C, 39% and 55% increment in the glass transition temperature, Young’s modulus, and hardness, respectively, and shows the improved creep resistance and dimensional stability. TEU-EP/33DDS is also characterized by the considerably reduced permittivity, dielectric loss factor, and flammability with high yie...