Thermoelastic damping of the axisymmetric vibration of circular plate resonators

Thermoelastic damping of the axisymmetric vibration of circular plate resonators
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DOI:
10.1016/j.jsv.2008.06.017
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发表时间:
2009-01
影响因子:
4.7
通讯作者:
Yuxin Sun;H. Tohmyoh
Yuxin Sun;H. Tohmyoh
中科院分区:
工程技术2区
文献类型:
--
作者:
Yuxin Sun;H. Tohmyoh

文献摘要

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热弹性阻尼被认为是微尺度圆板谐振器在室温下的一种重要损耗机制。本文建立了圆板轴对称离面振动的耦合热弹性问题的控制方程。进而得到了热弹性阻尼的解析表达式。研究了环境温度、板的尺寸和边界条件对热弹性阻尼的影响。
Thermoelastic damping is recognized as a significant loss mechanism at room temperature in micro-scale circular plate resonators. In this paper, the governing equations of coupled thermoelastic problems are established for axisymmetric out-of-plane vibration of circular plate. Then the analytical expression for thermoelastic damping is obtained. The effects of environmental temperature, plate dimensions and boundary conditions on the thermoelastic damping are studied.