Integration of microelectronic chips in microfluidic systems on printed circuit board
Integration of microelectronic chips in microfluidic systems on printed circuit board
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DOI：
10.1088/0960-1317/22/10/105022
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发表时间：
2012-10-01
影响因子：
2.3
通讯作者：
Baldi, A.
中科院分区：
文献类型：
--
作者：
Burdallo, I.;Jimenez-Jorquera, C.;Baldi, A.
提出了一种在印刷电路板上集成具有微流控结构的小型半导体传感器芯片的新方案。所提出的方法是基于一种封装技术，产生一个大而平坦的面积与小而浅（类似于44 μ m深）的芯片上的开口。所使用的基于二丙烯酸酯双酚A聚合物的光固化封装材料能够在中等温度（80摄氏度）下实现聚二甲基硅氧烷微流体结构的不可逆结合。这种集成方案使得能够将换能器芯片插入微流体系统中，其具有比先前方案更低的添加体积。泄漏测试表明，粘合结构可承受超过360 kPa的压力。具有两个检测芯片的原型微流体系统，包括用于电导率的一个叉指电极（IDE）芯片和用于pH的一个离子选择性场效应晶体管（ISFET）芯片，已经被实现和表征。已经实现了芯片接触和硅边缘表面与微通道中的溶液的良好电绝缘。这种集成过程为低成本制造复杂的分析微系统打开了大门，这些分析微系统联合收割机了微流体和硅微技术领域的非凡潜力。
A new scheme for the integration of small semiconductor transducer chips with microfluidic structures on printed circuit board (PCB) is presented. The proposed approach is based on a packaging technique that yields a large and flat area with small and shallow (similar to 44 mu m deep) openings over the chips. The photocurable encapsulant material used, based on a diacrylate bisphenol A polymer, enables irreversible bonding of polydimethylsiloxane microfluidic structures at moderate temperatures (80 degrees C). This integration scheme enables the insertion of transducer chips in microfluidic systems with a lower added volume than previous schemes. Leakage tests have shown that the bonded structures withstand more than 360 kPa of pressure. A prototype microfluidic system with two detection chips, including one inter-digitated electrode (IDE) chip for conductivity and one ion selective field effect transistor (ISFET) chip for pH, has been implemented and characterized. Good electrical insulation of the chip contacts and silicon edge surfaces from the solution in the microchannels has been achieved. This integration procedure opens the door to the low-cost fabrication of complex analytical microsystems that combine the extraordinary potential of both the microfluidics and silicon microtechnology fields.