Production of Hollow Spheres of Eutectic Tin-Lead Solder through a Coaxial Nozzle
Production of Hollow Spheres of Eutectic Tin-Lead Solder through a Coaxial Nozzle
复制标题
通过同轴喷嘴生产共晶锡铅焊料空心球
DOI:
10.1299/jmmp.4.1530
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发表时间:
2010
期刊:
影响因子:
--
通讯作者:
T. Minemoto
中科院分区:
文献类型:
--
作者:
Truong V. Vu;H. Takakura;J. Wells;T. Minemoto
Hollow eutectic tin-lead solder spheres with diameters from 3.5 to 4.5 mm have been produced directly from the melt. Raw solder placed in a crucible was melted at a temperature of typically about 50 0 C above its melting point. The molten solder was then extruded vertically downward into air at room temperature through the outer nozzle of a coaxial nozzle mounted at the crucible bottom. Capillary instability of the extruded hollow molten solder jet led to the formation of hollow solder spheres. This formation was assisted by a transverse nozzle placed close to the coaxial nozzle, which directed an inert gas past the hollow jet at position where sphere detached. The spheres were then quickly cooled and solidified by water mist prior to collection in a container filled with water. Most of these spheres were completely hermetic and had a relatively smooth surface. Hollow water spheres were also formed as a test of production of hollow solder spheres through the nozzle.