Fundamental Study on the Effect of Zn Addition Into Cu Matrix in DT Method Nb3Sn Conductors

Fundamental Study on the Effect of Zn Addition Into Cu Matrix in DT Method Nb3Sn Conductors
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Cu基体中Zn添加对DT法Nb3Sn导体影响的基础研究

DOI:
10.1109/tasc.2020.2972209
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发表时间:
2020
影响因子:
1.8
通讯作者:
Murakami Yukinobu
Murakami Yukinobu
中科院分区:
物理与天体物理3区
文献类型:
--
作者:
Banno Nobuya;Morita Taro;Yagai Tsuyoshi;Kawashima Shinya;Murakami Yukinobu

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神户制钢所开发了黄铜基分布式锡 (DT) 法 Nb3Sn 焊丝,旨在实现高性能和高坚固性。在这项工作中,对这些焊丝的扩散反应行为进行了微观结构研究,以详细了解铜和黄铜基体使用时的特性差异,并讨论了在铜基体中添加锌的影响,以进一步改进。在 Nb3Sn 形成之前,纯 Cu 和黄铜基体丝之间的 Sn/Cu 互扩散反应行为存在明显差异:例如,在 400 °C/200 h 热处理后,Cu 基体丝中的反应层形成 δ 和 ϵ 相,而黄铜基体丝中形成 β-CuZn 和 ϵ 相。 β相是固态的,似乎可以有效抑制空洞生长:最好避免空洞形成,因为空洞会物理性地抑制Sn扩散。黄铜基体促进锡渗透到铌亚元素模块中。使用黄铜基体的这些特性有利于在Nb 3 Sn形成步骤之前改善Sn在横截面上的分布,这将有助于在横截面上形成更均匀的Nb 3 Sn层。非 CuJcof 第二次试验黄铜 DT Nb3Sn 线在 16 T 和 4.2 K 下的电流值为 1,100 A/mm2。
Kobe Steel, Ltd. has developed brass matrix distributed-tin (DT) method Nb3Sn wires, aiming to achieve both highJcperformance and high robustness. In this work, microstructural study on the diffusion reaction behavior of those wires was conducted, to understand in detail the characteristic differences in use of Cu and brass matrix, and the effect of Zn addition into Cu matrix was discussed towards furtherJcimprovement. There were clear differences in the reaction behavior of Sn/Cu interdiffusion between the pure Cu and the brass matrix wires before Nb3Sn formation: for instance, after a heat treatment at 400 °C/200 h, δ and ϵ phases form at the reaction layer in the Cu matrix wire, while β-CuZn and ϵ phases form in the brass matrix wire. The β phase is solid and appears to be effective to suppress void growth: it is preferable to avoid void formation, as void physically suppresses the Sn diffusion. Brass matrix promoted Sn penetration into Nb subelement modules. Those characteristics in use of brass matrix are advantageous to improve Sn distribution across the cross-section prior to Nb3Sn formation step, which would contribute to more homogeneous Nb3Sn layer formation across the cross-section. The non-CuJcof 2nd trial brass DT Nb3Sn wire at 16 T and 4.2 K is 1,100 A/mm2.
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