Fundamental Study on the Effect of Zn Addition Into Cu Matrix in DT Method Nb3Sn Conductors
Fundamental Study on the Effect of Zn Addition Into Cu Matrix in DT Method Nb3Sn Conductors
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Cu基体中Zn添加对DT法Nb3Sn导体影响的基础研究
DOI:
10.1109/tasc.2020.2972209
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发表时间:
2020
影响因子:
1.8
通讯作者:
Murakami Yukinobu
中科院分区:
文献类型:
--
作者:
Banno Nobuya;Morita Taro;Yagai Tsuyoshi;Kawashima Shinya;Murakami Yukinobu
Kobe Steel, Ltd. has developed brass matrix distributed-tin (DT) method Nb3Sn wires, aiming to achieve both highJcperformance and high robustness. In this work, microstructural study on the diffusion reaction behavior of those wires was conducted, to understand in detail the characteristic differences in use of Cu and brass matrix, and the effect of Zn addition into Cu matrix was discussed towards furtherJcimprovement. There were clear differences in the reaction behavior of Sn/Cu interdiffusion between the pure Cu and the brass matrix wires before Nb3Sn formation: for instance, after a heat treatment at 400 °C/200 h, δ and ϵ phases form at the reaction layer in the Cu matrix wire, while β-CuZn and ϵ phases form in the brass matrix wire. The β phase is solid and appears to be effective to suppress void growth: it is preferable to avoid void formation, as void physically suppresses the Sn diffusion. Brass matrix promoted Sn penetration into Nb subelement modules. Those characteristics in use of brass matrix are advantageous to improve Sn distribution across the cross-section prior to Nb3Sn formation step, which would contribute to more homogeneous Nb3Sn layer formation across the cross-section. The non-CuJcof 2nd trial brass DT Nb3Sn wire at 16 T and 4.2 K is 1,100 A/mm2.
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影响因子:
3.6
作者:
Banno Nobuya;Morita Taro;Yu Zhou;Yagai Tsuyoshi;Tachikawa Kyoji
通讯作者:
Tachikawa Kyoji
影响因子:
1.7
作者:
N. Banno;Y. Miyamoto;K. Tachikawa
通讯作者:
K. Tachikawa
影响因子:
3.6
作者:
X. Xu;J. Rochester;X. Peng;M. Sumption;M. Tomsic
通讯作者:
M. Tomsic
影响因子:
1.8
作者:
N. Banno;Y. Miyamoto;K. Tachikawa
通讯作者:
K. Tachikawa
影响因子:
3.6
作者:
C. Sanabria;M. Field;P. Lee;H. Miao;J. Parrell;D. Larbalestier
通讯作者:
D. Larbalestier