Comparison of Design Tools for Stress Analysis of Adhesively Bonded Joints
Comparison of Design Tools for Stress Analysis of Adhesively Bonded Joints
复制标题
胶接接头应力分析设计工具的比较
DOI：
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发表时间：
2019
期刊：
影响因子：
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通讯作者：
Stephen Jones
中科院分区：
文献类型：
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作者：
S. Stapleton;A. Bergan;D. Sleight;B. Bednarcyk;Alana M. Zahn;B. Farrokh;K. Segal;B. Stier;Stephen Jones
尽管高保真度有限元模型不断涌现且具有灵活性，但较低保真度模型在粘合接头设计中仍然普遍使用。这些设计模型由于其简单性和易用性而可以节省计算时间和用户时间。当前的研究涉及对四种粘合接头设计模型预测的局部应力场的详细评估：A4EI、HyperSizer、Joint Element Designer 和连续实体壳有限元模型。所有模型都与高保真、密集网格有限元模型作为基准进行比较。对六种不同的双搭接接头案例与不同的特征组合进行了比较，包括金属和复合材料粘附体、夹层芯和倍锥度。正如预期的那样，模型全厚度位移插值的阶数是精度的重要驱动因素。然而，并非每种情况都需要更高阶插值才能获得准确的结果。
Despite the proliferation and flexibility of high fidelity finite element models, lower fidelity models remain commonly used in adhesively bonded joint design. These design models can save both computational and user time due to their simplicity and ease of use. The current study involves a detailed assessment of the local stress fields predicted by four bonded joint design models: A4EI, HyperSizer, Joint Element Designer, and a Continuum Solid Shell Finite Element model. All models were compared with a high fidelity, dense mesh finite element model as a benchmark. Six different double lap joint cases were compared with different combinations of features including metallic and composite adherends, a sandwich core, and doubler tapers. As expected, the order of the model’s through-thickness displacement interpolation was a significant driver of accuracy. However, not every case requires higher order interpolation to achieve accurate results.