Room-temperature hard coating of ultrananocrystalline diamond/nonhydrogenated amorphous carbon composite films on tungsten carbide by coaxial arc plasma deposition
Room-temperature hard coating of ultrananocrystalline diamond/nonhydrogenated amorphous carbon composite films on tungsten carbide by coaxial arc plasma deposition
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DOI：
10.7567/jjap.55.030302
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发表时间：
2016-01
影响因子：
1.5
通讯作者：
Hiroshi Naragino;Mohamed Egiza;A. Tominaga;K. Murasawa;Hidenobu Gonda;M. Sakurai;T. Yoshitake
中科院分区：
文献类型：
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作者：
Hiroshi Naragino;Mohamed Egiza;A. Tominaga;K. Murasawa;Hidenobu Gonda;M. Sakurai;T. Yoshitake
采用同轴弧等离子体沉积技术在未加热的含钴WC上沉积了超纳米晶金刚石(UNCD)/非氢化非晶碳(a-C)复合薄膜。薄膜的硬度为51.3 Gpa，与非偏置衬底上沉积的硬质a-C膜的最高值相当。沉积的薄膜厚度约为3微米，比硬质a-C薄膜厚一个数量级。薄膜的内压应力为4.5 Gpa，明显小于硬度较高的a-C薄膜。UNCD/a-C薄膜中大量晶界的存在可能对内应力的释放起到一定的作用。
Ultrananocrystalline diamond (UNCD)/nonhydrogenated amorphous carbon (a-C) composite films were deposited on unheated WC containing Co by coaxial arc plasma deposition. The hardness of the film is 51.3 GPa, which is comparable with the highest values of hard a-C films deposited on nonbiased substrates. The deposited film is approximately 3 µm thick, which is one order larger than that of hard a-C films. The internal compressive stress is 4.5 GPa, which is evidently smaller than that of comparably hard a-C films. The existence of a large number of grain boundaries in the UNCD/a-C film might play a role in the release of the internal stress.