Localized heating/bonding techniques in MEMS packaging
Localized heating/bonding techniques in MEMS packaging
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DOI：
10.1117/12.604579
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发表时间：
2005-05
期刊：
影响因子：
--
通讯作者：
J. R. Mabesa-;A. J. Scott;X. Wu;G. Auner
中科院分区：
文献类型：
--
作者：
J. R. Mabesa-;A. J. Scott;X. Wu;G. Auner
Packaging is used to protect and enable intelligent sensor systems utilized in manned/unmanned ground vehicle systems/subsystems. Because Micro electro mechanical systems (MEMS) are used often in these sensor or actuation products, it must interact with the surrounding environment, which may be in direct conflict with the desire to isolate the electronics for improved reliability/durability performance. For some very simple devices, performance requirements may allow a high degree of isolation from the environment (e.g., stints and accelerometers). Other more complex devices (i.e. chemical and biological analysis systems, particularly in vivo systems) present extremely complex packaging requirements. Power and communications to MEMS device arrays are also extremely problematic. The following describes the research being performed at the U.S. Army Research, Development, and Engineering Command (RDECOM) Tank and Automotive Research, Development, and Engineering Center (TARDEC), in collaboration with Wayne State University, in Detroit, MI. The focus of the packaging research is limited to six main categories: a) provision for feed-through for electrical, optical, thermal, and fluidic interfaces; b) environmental management including atmosphere, hermiticity, and temperature; c) control of stress and mechanical durability; d) management of thermal properties to minimize absorption and/or emission; e) durability and structural integrity; and f) management of RF/magnetic/electrical and optical interference and/or radiation properties and exposure.
