Multimaterial 3D Printing Technique for Electronic Circuitry Using Photopolymer and Selective Metallization
Multimaterial 3D Printing Technique for Electronic Circuitry Using Photopolymer and Selective Metallization
复制标题
使用光聚合物和选择性金属化的电子电路多材料 3D 打印技术
DOI：
10.1002/adem.202270048
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发表时间：
2022
影响因子：
3.6
通讯作者：
Ryspayeva A
中科院分区：
文献类型：
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作者：
Ryspayeva A
在此，提出了一种3D打印技术，其能够通过光聚合物打印和铜金属化来制造选择性电镀的聚合物物体。金属化塑料因其重量轻、设计灵活和制造成本低而在许多行业中很受欢迎。常见的金属化技术需要多个预处理步骤，例如表面蚀刻、敏化/活化和加速。所提出的方法通过消除敏化步骤，允许通过直接电镀对3D打印样品进行选择性金属化。该方法依赖于将银种子包含在丙烯酸酯和甲基丙烯酸酯基单体和低聚物的混合物中，这使得能够在3D打印后直接进行无电铜金属化。Ag（I）离子充当铜沉积的催化位点。用嵌入的2和4wt% Ag（I）种子生长的铜膜分别达到5.7 ± 1.2和7.7 ± 1.3 μm的厚度。此外，在同一样品上使用原始树脂和银改性树脂进行印刷允许选择性电镀：仅电镀改性树脂，而原始树脂不受影响。制造概念验证温度传感器以证明印刷互连的性能。
Herein, a 3D printing technique to enable the manufacturing of selectively plated polymer objects by photopolymer printing and copper metallization is presented. Metallized plastic has become popular in a number of industries due to its lightweight, flexibility of design, and cost‐effective fabrication. Common metallization techniques require multiple pretreatment steps, such as surface etching, sensitization/activation, and acceleration. The proposed method, by eliminating the sensitization step, allows selective metallization of 3D‐printed samples by direct plating. The method relies on the inclusion of silver seeds into a mixture of acrylate‐ and methacrylate‐based monomers and oligomers, which enables direct electroless copper metallization following 3D printing. Ag(I) ions act as catalytic sites for copper deposition. Copper films grown with embedded 2 and 4 wt% Ag(I) seeds reach thicknesses of 5.7 ± 1.2 and 7.7 ± 1.3 μm, respectively. Furthermore, printing with pristine and silver‐modified resins on the same sample allows selective plating: only the modified resin is plated leaving the pristine resin unaffected. A proof‐of‐concept temperature sensor is manufactured to demonstrate the performance of the printed interconnects.