Achieve Superior Electrocatalytic Performance by Surface Copper Vacancy Defects during Electrochemical Etching Process
Achieve Superior Electrocatalytic Performance by Surface Copper Vacancy Defects during Electrochemical Etching Process
复制标题
在电化学蚀刻过程中通过表面铜空位缺陷实现优异的电催化性能
DOI：
10.1002/anie.202002394
复制
发表时间：
2020-05-12
影响因子：
16.6
通讯作者：
Wang, Qin
中科院分区：
文献类型：
--
作者：
Guo, Niankun;Xue, Hui;Wang, Qin
Vacancy defects of catalysts have been extensively studied and proven to be beneficial to various electrocatalytic reactions. Herein, an ultra-stable three-dimensional PtCu nanowire network (NNW) with ultrafine size, self-supporting rigid structure, and Cu vacancy defects has been developed. The vacancy defect-rich PtCu NNW exhibits an outstanding performance for the oxygen reduction reaction (ORR), with a mass activity 14.1 times higher than for the commercial Pt/C catalyst (20 %.wt, JM), which is currently the best performance. The mass activity of the PtCu NNW for methanol oxidation reaction (MOR) is 17.8 times higher than for the commercial Pt/C catalyst. Density-functional theory (DFT) calculations indicate that the introduction of Cu vacancies enhances the adsorption capacity of Pt atoms to the HO* intermediate and simultaneously weakens the adsorption for the O* intermediate. This work presents a facile strategy to assemble efficient electrocatalysts with abundant vacancy defects, at the same time, provides an insight into the ORR mechanism in acidic solution.
