Stress relaxation induced faceted Cu and W particles on the surfaces of Cu–Zr and W thin films
Stress relaxation induced faceted Cu and W particles on the surfaces of Cu–Zr and W thin films
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DOI：
10.1016/j.apsusc.2009.03.098
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发表时间：
2009-08
影响因子：
6.7
通讯作者：
H. L. Sun;Z. Song;K. Xu
中科院分区：
文献类型：
--
作者：
H. L. Sun;Z. Song;K. Xu
通过对聚酰亚胺（PI）衬底上的铜锆薄膜和硅衬底上的钨薄膜进行退火处理，得到了亚微米尺度的铜和钨颗粒。有趣的是，发现Cu颗粒是多面的，并且从它们异常规则的外观来看似乎是单晶。然而，这是另一种情况下，为多晶和不规则的W颗粒。根据微观形貌特征、残余应力分析和原子扩散系数的差异，提出了Cu和W颗粒形成的不同机制。
Faceted copper and tungsten particles in submicron-scale were obtained by annealing copper–zirconium thin films on polyimide (PI) substrates as well as in the deposited tungsten films on Si substrates. It was interesting to find that the Cu particles are faceted and seem to be single crystal from their extraordinarily regular appearance. However, it is another case for W particles which are polycrystalline and irregular. Different mechanisms are put forward to elucidate the formation of Cu and W particles according to the morphological characterization, residual stress analysis and their distinct atomic diffusivity.