Microwave Acoustic Wave Devices: Recent Advances on Architectures, Modeling, Materials, and Packaging
Microwave Acoustic Wave Devices: Recent Advances on Architectures, Modeling, Materials, and Packaging
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DOI：
10.1109/tmtt.2018.2854160
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发表时间：
2018-10-01
影响因子：
4.3
通讯作者：
Tag, Andreas
中科院分区：
文献类型：
--
作者：
Hagelauer, Amelie;Fattinger, Gernot;Tag, Andreas
本文综述了声波器件在移动通信中的应用。在对体声波（BAW）和表面声波（SAW）器件的总体和历史介绍之后，对声波器件应用的体系结构进行了综述，这些结构驱动了对SAW和BAW器件的要求。在此之后，我们讨论了重要材料的技术进展。其次，概述了高功率水平下SAW和BAW的建模和表征。最后对包装技术进行了概述，并对未来的发展进行了展望。最后，对未来的发展进行了展望。
This paper reviews applications of acoustic wave devices in mobile communication. After a general and historical introduction to bulk acoustic wave (BAW) and surface acoustic wave (SAW) devices, a review is given on the architectures where acoustic wave devices are applied driving the requirements on the SAW and BAW components. Following this, we discuss the progress in technology important materials. Next, an overview on the modeling and characterization of SAW and BAW at high power levels is given. Finally an overview of packaging technologies and an outlook to future developments is provided. Finally, an outlook to future developments is provided.