Molecular Dynamics Simulation of Sintering Densification of Multi-Scale Silver Layer.
Molecular Dynamics Simulation of Sintering Densification of Multi-Scale Silver Layer.
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多尺度银层烧结致密化的分子动力学模拟
DOI：
10.3390/ma15062232
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发表时间：
2022-03-17
期刊：
影响因子：
--
通讯作者：
Yan H
中科院分区：
文献类型：
--
作者：
Liang P;Pan Z;Tang L;Zhang G;Yang D;He S;Yan H
本研究基于分子动力学（MD），采用随机算法建立了模拟银浆初始涂层形貌的模型，并分析了不同粒径颗粒对烧结孔隙率的影响。MD结果表明，在相同烧结条件下，与大尺寸银颗粒烧结工艺相比，多尺寸银颗粒烧结工艺可提高材料的致密化程度，从理论上验证了在大尺寸银颗粒中添加小银颗粒的可行性。此外，为了进一步验证多尺度烧结的可行性，采用半原位观察的方法对微纳米多尺度银浆料进行了烧结实验。通过理论和实验手段证明了多尺度银烧结的可行性，为优化烧结工艺和制备功率电子工业中的芯片贴装用银浆料提供了有意义的参考。此外，希望今后能在此基础上取得更好的进展。
Based on molecular dynamics (MD), in this study, a model was established to simulate the initial coating morphology of silver paste by using a random algorithm, and the effects of different sizes of particles on sintering porosity were also analyzed. The MD result reveals that compared with the sintering process using large-scale silver particles, the sintering process using multi-scale silver particles would enhance the densification under the same sintering conditions, which authenticates the feasibility of adding small silver particles to large-scale silver particles in theory. In addition, to further verify the feasibility of the multi-scale sintering, a semi in-situ observation was prepared for a sintering experiment using micro-nano multi-scale silver paste. The feasibility of multi-scale silver sintering is proved by theoretical and experimental means, which can provide a meaningful reference for optimizing the sintering process and the preparation of silver paste for die-attach in powering electronics industry. In addition, it is hoped that better progress can be made on this basis in the future.
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影响因子：
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