The design and properties of new, Pb-free solder alloys
The design and properties of new, Pb-free solder alloys
复制标题
新型无铅焊料合金的设计和性能
DOI：
10.1109/iemt.1994.404698
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发表时间：
1994
期刊：
影响因子：
--
通讯作者：
S. Jin
中科院分区：
文献类型：
--
作者：
M. McCormick;S. Jin
Environmental and health concerns about the toxicity of Pb in solders have prompted a great deal of research to find suitable Pb-free replacement alloys. The goal of the research presented in this paper is to identify Pb-free alloys as close in melting temperature to the near-eutectic 40 Pb-60 Sn solder (melting point of 183/spl deg/C) that possess the best combination of mechanical properties. Enhanced mechanical properties are achieved through metallurgical manipulation of alloy microstructures. Three alloys are presented with superior mechanical properties: i) Sn-3.5 Ag-1 Zn with a melting point of /spl sim/217/spl deg/C, ii) Sn-3.5Ag-1 Zn-0.5 Cu with a melting point of /spl sim/226/spl deg/C, and iii) Sn-8Zn-5In-(O.1-0.5)Ag with a melting point of /spl sim/187/spl deg/C.<<ETX>>
