Analysis of key parameters affecting the thermal behavior and performance of quantum cascade lasers
Analysis of key parameters affecting the thermal behavior and performance of quantum cascade lasers
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DOI：
10.1063/1.2344812
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发表时间：
2006-09-01
影响因子：
3.2
通讯作者：
Tian, Zhao-bing
中科院分区：
文献类型：
--
作者：
Zhu, Cheng;Zhang, Yong-gang;Tian, Zhao-bing
本文研究了影响量子级联激光器（QCL）热行为和性能的一些关键参数。我们考虑到温度依赖的层的热传导参数，包括它们的界面热阻。我们的研究表明，对于具有相当厚的活性核的QCL结构，由许多异质界面，热边界电阻起着至关重要的作用。本文采用有限元方法对不同结构和不同封装方式的QCL的散热进行了数值模拟。然后将这些与现有的实验数据进行定量比较。结果表明：（1）采用埋层和/或厚镀金结构的外延层向上安装是外延层向下安装的良好替代;（2）采用InP包层和等离子体激元层替代InAlAs/InGaAs进一步改善了传热特性。另一方面，为了在室温下实现连续工作，驱动电流密度必须被优化到比传统上认为的低得多的水平。模拟结果还表明，QCL的活动核心的温度分布的实质性的不均匀性，将产生显着的激光光谱的影响。在本文中，我们还提出了调查和讨论的InGaAs/AlGaAsSb QCL的热性能及其与各种参数的相关性。(c)2006年，美国物理学会。
In this paper, we present an investigation of some key parameters affecting the thermal behavior and performance of quantum cascade lasers (QCLs). We take into account the temperature dependent heat conducting parameters of the layers, including their interface thermal resistance. Our study shows that for QCL structures with a rather thick active core comprised of many heterointerfaces, the thermal boundary resistances play a crucial role. We use a finite element method to simulate the heat dissipation in QCLs with different structures and different packaging methods. These are then quantitatively compared with existing experimental data. Results show that (1) epilayer-up mounting with buried and/or thick gold plated structures is a good substitute for epilayer-down mounting, and (2) using InP cladding and plasmon layer replacing InAlAs/InGaAs further improves heat transfer characteristics. On the other hand, for reaching cw operation at room temperature, the driving current density must be optimized to a significantly lower level than what is conventionally believed. The simulations also reveal that the substantial nonuniformity of temperature distribution in the active core of QCLs should have a significant effect on the resulting laser spectra. In this paper, we also present investigations and discussions on the thermal performance of InGaAs/AlGaAsSb QCLs and its correlations to various parameters. (c) 2006 American Institute of Physics.