Formation of compositionally graded Ni-P deposits containing SiC particles by jet electroplating
Formation of compositionally graded Ni-P deposits containing SiC particles by jet electroplating
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通过喷射电镀形成含有 SiC 颗粒的成分梯度 Ni-P 沉积物
DOI：
10.2320/matertrans1989.38.43
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发表时间：
1997
期刊：
影响因子：
--
通讯作者：
M. Okumiya
中科院分区：
文献类型：
--
作者：
H. Takeuchi;Y. Tsunekawa;M. Okumiya
本文提出了一种新的电镀工艺，该工艺使用含有 SiC 颗粒的电解液射流来形成电沉积 Ni-P 基体复合涂层。电解液射流显着提高了电镀中的极限电流密度，因此沉积速率将比没有电解液射流的传统电镀快约10倍。快速的沉积速率是由于电解质射流导致邻近阴极表面的薄扩散层造成的。射流速度决定SiC颗粒的体积分数在0∼30 vol%范围内，而不改变电解质中颗粒的浓度。沉积物中的磷含量也由喷射速度控制，而不改变电解液中次膦酸的浓度。因此，喷射电镀以极快的沉积速率实现了具有关于磷含量和颗粒体积分数的成分梯度的SiC颗粒/Ni-P沉积。
This paper presents a new electroplating process that uses an electrolyte jet containing SiC particles for the formation of electrodeposited Ni-P matrix composite coatings. The electrolyte jet remarkably increases the limiting current density in electroplating, so that the deposition rate will be approximately 10 times faster than that of conventional electroplating without an electrolyte jet. The fast deposition rate is caused by the thin diffusion layer adjacent to the cathode surface due to the electrolyte jet. The jet velocity determines the volume fraction of SiC particles in the range of 0∼30 vol% without changing the particle concentration in electrolytes. The phosphorus content in deposits is also controlled by the jet velocity without changing the phosphinic acid concentration in electrolytes. Hence, the jet electroplating realizes SiC particle/Ni-P deposits with a compositional gradient regarding the phosphorus content and the particle volume fraction with an extremely fast deposition rate.