A deeper understanding on the motion behaviors of wire during ultrasonic wedge-wedge bonding process
A deeper understanding on the motion behaviors of wire during ultrasonic wedge-wedge bonding process
复制标题
更深入地了解超声波楔-楔键合过程中导线的运动行为
DOI：
10.4071/isom-2016-tha31
复制
发表时间：
2016
期刊：
影响因子：
--
通讯作者：
J. Twiefel
中科院分区：
文献类型：
--
作者：
Y. Long;F. Dencker;M. Wurz;A. Feldhoff;J. Twiefel
摘要超声波引线键合是一种主要的互连技术，在封装工业中已经应用了几十年。然而，线/基板界面和线/工具界面处的现象尚不清楚。具体而言，必须深入了解键合过程中导线的运动行为。在这个项目中，在电线/工具界面处的相对运动幅度和在电线/基板界面处的自清洁效率进行了研究，通过分析的人工涂层。对于每个实验，通过物理气相沉积将由特定材料制成的薄层涂覆到400 μm导线的表面上。在键合过程之后，通过扫描电子显微镜观察层厚度的变化。结果表明，复杂的相对运动行为的线/工具界面。圆角接触区的相对运动幅值大于其它接触周边区，而圆角接触区的相对运动幅值大于其它接触周边区。
Abstract Ultrasonic wire bonding is a dominating interconnection technique that has been applied in packaging industry for decades. The phenomena at the wire/substrate interface and the wire/tool interface, however, are not clear yet. Specifically, the motion behaviors of the wire during the bonding process have to be deeply understood. In this project, the relative motion amplitudes at the wire/tool interface and the self-cleaning efficiency at the wire/substrate interface are investigated via the analysis of an artificially coated layer. For each experiment, a thin layer made of a specific material was coated onto the surface of a 400 μm wire by physical vapor deposition. The change of thicknesses of the layer was observed by a scanning electron microscope after the bonding process. The results indicated a complex relative motion behavior at the wire/tool interface. The relative motion amplitude at the fillets contact regions is higher than that at the other contact perimeter regions while the amplitude...