Endurance enhancement of Cu-oxide based resistive switching memory with Al top electrode
Endurance enhancement of Cu-oxide based resistive switching memory with Al top electrode
复制标题
铝顶电极氧化铜基阻变存储器的耐久性增强
DOI:
10.1063/1.3142392
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发表时间:
2009-05-25
影响因子:
4
通讯作者:
Chi, M. H.
中科院分区:
文献类型:
--
作者:
Lv, Hangbing;Wang, Ming;Chi, M. H.
We investigated the switching performance of Cu-oxide films with Al, Pt, and Ti electrodes. Compared with Pt electrode, the Al electrode shows better stability, preferable endurance, and larger resistance ratio. An interface AlOx layer is detected by transmission electron microscopy and Auger electron spectroscopy. This layer can strongly affect the movement of oxygen vacancies. However, the sample with pure Ti electrode almost has no switching characteristics. Ti/TiN electrode with thin Ti exhibits good switching behavior. The thickness control of Ti layer is quite critical. So we suggest that the oxygen diffusion in electrode is another important factor for switching performance.We investigated the switching performance of Cu-oxide films with Al, Pt, and Ti electrodes. Compared with Pt electrode, the Al electrode shows better stability, preferable endurance, and larger resistance ratio. An interface AlOx layer is detected by transmission electron microscopy and Auger electron spectroscopy. This layer can strongly affect the movement of oxygen vacancies. However, the sample with pure Ti electrode almost has no switching characteristics. Ti/TiN electrode with thin Ti exhibits good switching behavior. The thickness control of Ti layer is quite critical. So we suggest that the oxygen diffusion in electrode is another important factor for switching performance.