Dielectric, mechanical and thermal properties of all-organic PI/PSF composite films by in situ polymerization
Dielectric, mechanical and thermal properties of all-organic PI/PSF composite films by in situ polymerization
复制标题
原位聚合全有机PI/PSF复合薄膜的介电、机械和热性能
DOI：
10.1515/epoly-2020-0020
复制
发表时间：
2020-01-01
期刊：
影响因子：
3.7
通讯作者：
Hou, Haoqing
中科院分区：
文献类型：
--
作者：
Li, Peng;Yu, Jiajun;Hou, Haoqing
现代电子工业和储能领域对全有机高介电材料的需求越来越大。本文采用原位聚合法制备了不同聚砜含量的全有机聚酰亚胺/聚砜复合膜（PI/PSF-X），并对其进行了流延和热处理。通过介电性能测试、拉伸性能测试、热重分析和动态力学分析等手段对PI/PSF-X复合薄膜的介电性能、力学性能和热性能进行了表征。结果表明，PI/PSF-X复合薄膜具有良好的介电性能、良好的力学性能和优异的热性能，适合应用于恶劣环境尤其是高温环境下的电子器件。
All-organic high dielectric materials are highly required in the field of modern electronic industry and energy storage. In this work, all-organic polyimide/polysulfone composite films with different amounts of PSF (PI/PSF-X) were prepared by in situ polymerization followed by film casting and thermal treatment. The dielectric, mechanical and thermal properties of these PI/PSF-X composite films are characterized by dielectric measurement, tensile test, thermogravimetric analysis and dynamic mechanical analysis. The results suggest that the PI/PSF-X composite films have good dielectric properties, good mechanical properties and excellent thermal properties, which are suitable for applications in electronic devices in harsh environments, especially in high-temperature environments.