A Comparative Study of The Fatigue Behavior of SnAgCu and SnPb Solder Joints
A Comparative Study of The Fatigue Behavior of SnAgCu and SnPb Solder Joints
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SnAgCu和SnPb焊点疲劳行为的比较研究
DOI：
10.4028/www.scientific.net/kem.297-300.831
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发表时间：
2005
期刊：
影响因子：
--
通讯作者：
Soon
中科院分区：
文献类型：
--
作者：
I. Kim;T. Park;S. Yang;Soon
采用伪功率循环试验法对63Sn37Pb焊点和两种无铅焊点的疲劳行为进行了比较，该方法比室循环法提供了更真实的焊点载荷循环。在不同的温度范围内进行了拟功率循环试验，以评价剪切应变效应。采用非线性有限元模型对BGA封装焊点的热致粘塑性变形进行了模拟。结果表明，无铅焊点在低温条件下具有良好的疲劳性能，产生的应变较小。然而，在引起大应变的高温条件下，含铅焊点具有较长的疲劳寿命。
Fatigue behaviors of 63Sn37Pb and two types of lead-free solder joints were compared using pseudo-power cycling testing method, which provides more realistic load cycling to solder joints than chamber cycling method does. Pseudo-power cycling test was performed in various temperature ranges to evaluate the shear strain effect. A nonlinear finite element model was used to simulate the thermally induced visco-plastic deformation of solder joint in BGA packages. The results revealed that lead free solder joints have a good fatigue property in the low temperature condition, where a small strain was induced. In the high temperature condition where a large strain was induced, however, lead contained solder joints have a longer fatigue life.