Early defect identification for micro light‐emitting diode displays via photoluminescent and cathodoluminescent imaging
Early defect identification for micro light‐emitting diode displays via photoluminescent and cathodoluminescent imaging
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DOI：
10.1002/jsid.985
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发表时间：
2021-02
影响因子：
2.3
通讯作者：
Keith Behrman;Julie Fouilloux;T. Ireland;G. Fern;J. Silver;Ioannis Kymissis
中科院分区：
文献类型：
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作者：
Keith Behrman;Julie Fouilloux;T. Ireland;G. Fern;J. Silver;Ioannis Kymissis
超高分辨率微型发光二极管（LED）显示器正在成为自发光显示器的可行技术。具有数百万像素的微型LED显示器面临的几个关键问题是在LED制造和转移期间的保真度、工艺控制和缺陷分析。在这里，我们研究了两种非破坏性测试方法，光致发光和阴极发光成像，并将其与电致发光图像进行比较，以验证LED保真度，并评估这些方法作为缺陷分析的潜在工具。我们表明，利用阴极发光成像作为分析工具提供了丰富的数据集，可以识别和分类的常见缺陷，在微型LED显示器制造过程中，对应于电致发光。然而，光致发光成像不是保真度分析的有效方法，但确实提供了有关干法蚀刻均匀性的信息。
Ultrahigh‐resolution micro light‐emitting diode (LED) displays are emerging as a viable technology for self‐emissive displays. Several of the critical issues facing micro LED displays with millions of pixels are fidelity, process control, and defect analysis during LED fabrication and transfer. Here, we investigate two non‐destructive test methods, photoluminescent and cathodoluminescent imaging, and compare them with electroluminescent images to verify LED fidelity and evaluate these methods as potential tools for defect analysis. We show that utilizing cathodoluminescent imaging as an analysis tool provides a rich data set that can identify and categorize common defects during micro LED display fabrication that correspond to electroluminescence. Photoluminescent imaging, however, is not an effective method for fidelity analysis but does provide information on dry‐etching uniformity.