Influence of Resin Viscosity and Filler Volume on Self-Organized Micro Interconnection
Influence of Resin Viscosity and Filler Volume on Self-Organized Micro Interconnection
复制标题
树脂粘度和填料体积对自组织微互连的影响
DOI：
10.4028/www.scientific.net/msf.512.367
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发表时间：
2006
期刊：
影响因子：
--
通讯作者：
K. Fujimoto
中科院分区：
文献类型：
--
作者：
K. Yasuda;Koushi Ohta;K. Fujimoto
开发了使用含有低熔点合金填料的树脂的新型选择性互连，作为低温和高可靠性电子互连的高密度组装方法。通过填料的聚结和填料的拉普拉斯压力对端子材料的润湿，在端子上形成自组织。采用符合真实的过程的多填料分散模型，通过数值分析研究了填料体积比和树脂粘度对自组织互连的影响，并采用归一化参数（自组织比）进行了评价。阐明了填料体积比最优值的存在性。随着粘度的增加，速度控制因素由填料体积转化为流入速度。
The novel selective interconnection using the resin containing low-melting-point-alloy fillers was developed as a high density assembly method of a low-temperature and highly reliable electronic interconnection. By means of the coalescence of fillers and wetting onto the terminal material due to the Laplace pressure of the fillers, self-organization onto the terminals was formed. The influence of the filler volume ratio and resin viscosity on the self-organized interconnecting was investigated by the numerical analysis with a multi-filler dispersion model corresponding to a real process, and was evaluated by using the normalized parameter (self-organization ratio). We clarified the existence of the optimal value of the filler volume ratio. The rate controlling factor transferred from the filler volume to the inflow velocity by the increase of the viscosity.