Ultrahigh temperature platinum microheater encapsulated by reduced-TiO2 barrier layer
Ultrahigh temperature platinum microheater encapsulated by reduced-TiO2 barrier layer
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DOI：
10.1016/j.sna.2019.07.023
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发表时间：
2019-09-01
影响因子：
4.6
通讯作者：
Kanno, Isaku
中科院分区：
文献类型：
--
作者：
Akasaka, Shunsuke;Boku, Encho;Kanno, Isaku
本文研究了Pt/阻挡层界面的热稳定性和粘附性。还原TiO 2，或TiO 2-δ，被发现提供更强的附着力和更大的热稳定性作为一个屏障层的Pt比TiN和化学计量TiO 2。它可以长期高温运行。在Pt/TiO2-δ的叠层中，在700 ℃的温度下退火后没有看到空隙或剥离;而在TiN和TiO2上的Pt层中分别不可避免地出现空隙和剥离。确认由Pt/TiO2-delta微型加热器组成的微型加热板在800 ℃下以120 mW的加热功率工作。加热响应时间在150 ℃和800 ℃之间低于20 ms。在室温和550摄氏度之间进行1000万次温度调节，没有造成任何性能下降。(C)2019 Elsevier B.V.版权所有。
Thermal stability and adhesion of the Pt/barrier interface were investigated herein. Reduced-TiO2, or TiO2-delta, was found to offer stronger adhesion and greater thermal stability as a barrier layer for Pt than that of TiN and stoichiometric TiO2. It enables a long-term high-temperature operation. No voids or peeling was seen after annealing at a temperature of 700 degrees C in a stacked layer of Pt/TiO2-delta; whereas, voids and peeling inevitably appeared in Pt layers on TiN and TiO2, respectively. A microhotplate composed of a Pt/TiO2-delta microheater was confirmed to perform at 800 degrees C at a heating power of 120 mW. The heating response time was below 20 ms between 150 degrees C and 800 degrees C. Ten million cycles of temperature modulation between room temperature and 550 degrees C did not cause any performance deterioration. (C) 2019 Elsevier B.V. All rights reserved.