Kinematic simulation of high-performance grinding for analysis of chip parameters of single grains
Kinematic simulation of high-performance grinding for analysis of chip parameters of single grains
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DOI：
10.1016/j.cirpj.2012.07.004
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发表时间：
2012-01-01
影响因子：
4.8
通讯作者：
Kirsch, B.
中科院分区：
文献类型：
--
作者：
Aurich, J. C.;Kirsch, B.
本文给出了磨削过程运动学模拟 (KSIM) 的综合观点。通过对砂轮形貌的详细建模，KSIM 能够计算和评估参与材料去除过程的每个颗粒的切屑参数。这提供了以实验不可能实现的详细程度研究研磨过程的机会。使用 KSIM，可以研究工艺参数和砂轮形貌变化对切屑参数以及材料去除过程的影响，并将其用于工艺、工具的优化以及工艺与机器相互作用的评估。本文总结了过去 12 年中涉及 KSIM 的研究活动，并提出了使用该仿真工具进行建模过程和过程与机器交互检查的新见解。 (C) 2012 CIRP。
In this paper, a comprehensive view on a kinematic simulation of the grinding process (KSIM) is given. Using detailed modeling of the grinding wheel topography, KSIM is able to compute and evaluate chip parameters of each grain participating in the material removal process. This provides the opportunity to investigate the grinding process in a level of detail impossible to achieve in experiments. Using KSIM, the influence of process parameters and changes in the grinding wheel topography on the chip parameters and hence on the material removal process can be investigated and used for optimization of the process, the tool and for evaluation of process-machine interactions. The paper summarizes the research activities involving KSIM conducted in the last 12 years and presents new insights in the modeling process and the examination of process-machine interactions using this simulation tool. (C) 2012 CIRP.