Plating of Small Blind Vias
Plating of Small Blind Vias
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小盲孔电镀
DOI：
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发表时间：
1999
期刊：
影响因子：
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通讯作者：
A. Hung
中科院分区：
文献类型：
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作者：
Show;A. Hung
金属化层压板的盲孔上的电介质侧进行化学镀铜，随后电镀铜。利用反射显微镜对直径在125 ~ 75 m之间的盲孔的垂直截面进行了分析。结果表明，在金属化的预处理过程中，超声振动可以使小盲孔的内壁完全无空隙地化学镀铜。此外，在后续的铜电镀过程中引入周期性脉冲反转电流，导致高分散功率沉积。通过采用这两个协议，它已被证明，高的投掷功率沉积可以很容易地实现为直径小至75米，纵横比为3：1的盲孔。
Metallization of laminates with blind vias on the dielectric side was performed by electroless copper plating with subsequent copper electroplating. The vertical cross section of blind vias with diameters between 125 and 75 m were analyzed by reflective microscopy. Results indicate that ultrasonic vibra- tion during the pretreatment processes of metallization enables complete electroless copper deposition of the inside wall of the small blind vias without any voids. Furthermore, the introduction of periodic pulse reversal current for the subsequent copper electroplating process resulted in high throwing power deposition. By employing these two protocols, it has been demonstrated that high throwing power deposition can be readily achieved for blind vias as small as 75 m in diameter with an aspect ratio of 3:1.