Monitoring Adhesive Joints Using Piezoelectric Polymer Film
Monitoring Adhesive Joints Using Piezoelectric Polymer Film
复制标题
使用压电聚合物薄膜监测粘合接头
DOI：
10.1177/1045389x9300400319
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发表时间：
1993
期刊：
影响因子：
--
通讯作者：
D. Dillard
中科院分区：
文献类型：
--
作者：
G. L. Anderson;J. Mommaerts;Shi Tang;J. Duke;D. Dillard
讨论了采用聚偏二氟乙烯压电薄膜的粘合接头监测技术。使用薄膜通过超声波进行粘合剂固化监测和空隙/孔隙率检测。通过将薄膜传感器嵌入粘合剂粘合层并测量传感器中应力产生的电压来量化循环粘合法向应力。
Adhesive joint monitoring techniques employing poly(vmylidene fluoride) piezoelectric film are discussed. Adhe sive cure monitoring and void/porosity detection were performed ultrasonically using the film. Cyclic bond-normal stresses were quantified by imbedding film sensors into the adhesive bondline and measuring the electrical voltages produced in the sensors by the stresses.