Use of Monocrystalline Silicon as Tool Material for Highly Accurate Blanking of Thin Metal Foils
Use of Monocrystalline Silicon as Tool Material for Highly Accurate Blanking of Thin Metal Foils
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使用单晶硅作为刀具材料实现薄金属箔的高精度冲裁
DOI：
10.1063/1.3589561
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发表时间：
2011
期刊：
影响因子：
--
通讯作者：
M. Merklein
中科院分区：
文献类型：
--
作者：
S. Hildering;U. Engel;M. Merklein
金属批量生产组件的小型化和组件功能的增加的趋势仍未中断。通过成形和下料来制造这些部件提供了经济和生态方面的优势以及所需的精度。用传统制造方法制造几何尺寸低于50μm的工具的复杂性变得不成比例地增加。要获得足够的表面粗糙度和精确的几何细节，需要昂贵的连续精加工操作。制造这种工具的一种新方法是使用在微系统技术中成熟的单晶硅的先进刻蚀技术。宽度可达5μm的高精度垂直几何图形是可能的。本研究提出了一种新的概念，利用这种电势，以单晶硅为工具材料冲裁薄铜箔。设计了一种外形紧凑的自给式机床，避免了10个零件的损坏.
The trend towards miniaturisation of metallic mass production components combined with increased component functionality is still unbroken. Manufacturing these components by forming and blanking offers economical and ecological advantages combined with the needed accuracy. The complexity of producing tools with geometries below 50 μm by conventional manufacturing methods becomes disproportional higher. Expensive serial finishing operations are required to achieve an adequate surface roughness combined with accurate geometry details. A novel approach for producing such tools is the use of advanced etching technologies for monocrystalline silicon that are well‐established in the microsystems technology. High‐precision vertical geometries with a width down to 5 μm are possible. The present study shows a novel concept using this potential for the blanking of thin copper foils with monocrystallline silicon as a tool material. A self‐contained machine‐tool with compact outer dimensions was designed to avoid ten...