Review on high heat flux flow boiling of refrigerants and water for electronics cooling
Review on high heat flux flow boiling of refrigerants and water for electronics cooling
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DOI：
10.1016/j.ijheatmasstransfer.2021.121787
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发表时间：
2021-12
影响因子：
5.2
通讯作者：
Behnam Parizad Benam;A. Sadaghiani;Vedat Yağcı;Murat Parlak;K. Sefiane;A. Koşar
中科院分区：
文献类型：
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作者：
Behnam Parizad Benam;A. Sadaghiani;Vedat Yağcı;Murat Parlak;K. Sefiane;A. Koşar
随着微米和纳米制造能力的进步，高热通量设备（例如计算机芯片、激光二极管和其他电子设备和组件）的散热一直是一个重要问题。高热通量建议采用包括流动沸腾在内的相变传热模式来实现微型设备的有效冷却。与池沸腾相比，流动沸腾传热是一种应用较多的传热方式，在高热通量冷却系统中应用最为广泛。改善流动沸腾传热有两种常用方法：主动方法和被动方法。在这篇综述中，涵盖了所有主动和被动方法，并且几乎包括了所有与高热通量相关的文献。本次综述的其他有用部分是表格，其中总结了几乎所有相关文献，包括对各种工质（特别是制冷剂）、通道尺寸以及实现高热通量条件的改进方法的研究，以便该领域的科学家和工程师可以从中受益匪浅。最后，综述提出了该领域的重要进展、广泛结论以及未来研究的建议和未来研究方向。
Heat removal from high heat flux devices such as computer chips, laser diodes, and other electronic devices and components has been a significant issue with the advances in micro- and nanofabrication capabilities. High heat fluxes suggest phase-change heat transfer modes including flow boiling to accomplish effective cooling of miniature devices. In contrast to pool boiling, flow boiling heat transfer is a more applied mode of heat transfer and has been most widely used in high heat flux cooling systems. There are two general approaches for improving flow boiling heat transfer: active and passive methods. In this review, all of the active and passive methods are covered, and almost all of the literature related to high heat flux is included. The other useful parts of this review are the tables, where almost all of the related literature, including studies on various working fluids (particularly refrigerants), channel sizes, and improvement methods to achieve high heat flux conditions are summarized so that scientists and engineers working in the field could greatly benefit from them. At the end, the review presents important developments in the field broad conclusion as well as suggestions and future research directions for future studies.