Fracture toughness of intermetallic Cu6Sn5 in lead-free solder microelectronics
Fracture toughness of intermetallic Cu6Sn5 in lead-free solder microelectronics
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DOI：
10.1016/j.scriptamat.2016.05.039
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发表时间：
2016-10
影响因子：
6
通讯作者：
B. Philippi;K. Matoy;J. Zechner;C. Kirchlechner;G. Dehm
中科院分区：
文献类型：
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作者：
B. Philippi;K. Matoy;J. Zechner;C. Kirchlechner;G. Dehm
尽管无铅Sn-Ag-Cu基钎料合金正在成为取代成熟但危险的含铅钎料的有前途的候选者，但它们的机械性能方面的知识有限。为了确保微电子领域的高可靠性要求，需要对关键微观结构元素（如在常见Cu金属化界面形成的cu6sn5金属间化合物）的断裂性能进行量化。虽然压痕断裂测试方法显示了不同的断裂韧性值，但本研究对fib制备的单晶cu6sn5悬臂梁进行了微悬臂断裂测试，以阐明微结构-断裂关系。
Even though lead-free Sn-Ag-Cu based solder alloys are emerging as promising candidates to replace well-established but hazardous lead-containing solders, they suffer from limited knowledge about their mechanical performance. To ensure the high reliability demands in microelectronics, fracture properties need to be quantified with respect to crucial microstructural elements like Cu6Sn5intermetallic compounds formed at common Cu metallization interfaces. While indentation fracture testing methods have shown varying fracture toughness values, micro-cantilever fracture testing is applied in this work on FIB-prepared single-crystalline Cu6Sn5cantilevers to clarify on the microstructure-fracture relationship.