Residual stress effects on plastic deformation and interfacial fracture in thin-film structures
Residual stress effects on plastic deformation and interfacial fracture in thin-film structures
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DOI：
10.1016/j.actamat.2005.01.005
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发表时间：
2005-04-01
期刊：
影响因子：
9.4
通讯作者：
Dauskardt, RH
中科院分区：
文献类型：
--
作者：
Litteken, CS;Strohband, S;Dauskardt, RH
韧性薄膜中的残余应力对薄膜结构脱粘过程中薄膜的塑性程度和界面断裂能有显著影响。具体来说，在含有相邻韧性Cu膜的薄膜结构中，TaN/SiO(2)界面的界面抗断裂能力与计算模型的预测结果进行了比较。与含有Cu薄膜的类似结构相比，含有Cu薄膜的压缩结构的TaN/SiO(2)界面断裂能提高50%。残余应力对界面粘附的影响从Cu膜内屈服的开始程度来解释，这影响了塑性能量耗散对界面总断裂能的贡献。(c) 2005材料学报Elsevier Ltd.出版。版权所有。
Residual stress in ductile thin films is shown to significantly affect the extent of film plasticity and interfacial fracture energy during debonding in thin-film structures. Specifically, the interfacial fracture resistance of a TaN/SiO(2) interface in a thin-film structure containing an adjacent ductile Cu film with varying residual stress is compared to predictions from computational models. The fracture energy of the TaN/SiO(2) interface increased by 50% for structures containing a Cu film in compression compared to similar structures with the film in tension. The effect of residual stress on interfacial adhesion is rationalized in terms of the onset of yielding within the Cu film, which affects the contribution from plastic energy dissipation to the total interface fracture energy. (c) 2005 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.