Characteristics of chip formation in the micro-drilling of multi-material sheets
Characteristics of chip formation in the micro-drilling of multi-material sheets
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多材料板材微钻孔切屑形成特性
DOI：
10.1016/j.ijmachtools.2011.08.017
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发表时间：
2012
影响因子：
14
通讯作者：
Yang, Lipeng
中科院分区：
文献类型：
--
作者：
Wang, Chengyong;Fu, Lianyu;Zheng, Lijuan;Song, Yuexian;Yang, Lipeng
为了满足电子产品小型化的要求，将需要使用更薄、更小的印刷电路板（pcb）。为了实现这一目标，必须在比以前更小的区域内钻出更多的微孔。pcb是由介电层（树脂/玻璃纤维布）和高纯度金属导体（铜箔）组成的各向异性多材料片。在钻孔PCB微孔时，很难达到较高的加工精度、表面质量、钻孔效率和较长的钻头寿命。在本研究中，使用直径为0.1mm的微钻头在高达300krpm的转速下钻取pcb。钻井过程被数码拍摄下来。观察了切屑形貌和孔壁。对孔壁粗糙度、钉头和出口毛刺形成等孔壁质量进行了观察和测量。研究了钻孔条件对钻孔过程和孔质量的影响。研究发现，芯片和孔壁表面的形貌取决于印刷电路板的材料特性。切屑通常是由铝入口板形成的锥形螺旋切屑，由铜箔形成的锥形螺旋切屑以及由玻璃纤维和软化树脂形成的不连续切屑。铜箔的孔壁比树脂/玻璃纤维布层的孔壁光滑得多。然而，在铜箔层形成钉头和毛刺，降低了孔质量。进给速度、主轴转速和刀具磨损对切屑形貌和孔质量均有影响。分析了PCB微孔的基本去除机理，为进一步开展该领域的工作奠定了坚实的基础。
In order to meet the requirements of electronic product miniaturisation, the use of thinner and smaller printed circuit boards (PCBs) will be required. To achieve this, many more micro-holes must be drilled in a smaller area than before. PCBs are anisotropic multi-material sheets consisting of a dielectric layer (resin/glass fibre cloth) and a high purity metal conductor (copper foil). It is difficult to achieve high machining precision, surface quality, drilling efficiency and long drill life when drilling PCB micro-holes. In this study, micro-drills with a diameter of 0.1mm were used to drill the PCBs at rotational speeds of up to 300krpm. The drilling process was digitally photographed. The chip morphology and the hole wall were observed. The quality of the hole wall, such as hole wall roughness and nail head and exit burr formation were observed and measured. The influence of drilling condition on the drilling process and hole quality were studied. It was found that the morphology of the chips and the hole wall surface depended on the material properties of the printed circuit board. Chips were formed normally as conical helical chips from the aluminium entry board, conical helical chips from the copper foil and discontinuous chips from the glass fibre and softened resin. The hole wall through the copper foil seemed much smoother than that of resin/glass fibre cloth layer. However, nail heads and burrs were formed at the copper foil layers, which decreased the hole quality. Chip morphology and hole quality were affected by feed rate, spindle speed and tool wear. The basic removal mechanism of the PCB micro-holes was analysed, and this study provided a firm foundation for further work in this area.
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DOI：
10.1016/s0007-8506(07)63021-2
发表时间：
1996
期刊：
CIRP Annals
影响因子：
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作者：
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通讯作者：
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发表时间：
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期刊：
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发表时间：
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影响因子：
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作者：
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发表时间：
1998
期刊：
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影响因子：
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通讯作者：
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10.1016/j.ijmachtools.2004.11.004
发表时间：
2005-06
影响因子：
14
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M. Bakkal;A. Shih;S. Mcspadden;C. Liu;R. Scattergood