Inkjet-printed interconnects for unpackaged dies in printed electronics
Inkjet-printed interconnects for unpackaged dies in printed electronics
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用于印刷电子产品中未封装芯片的喷墨印刷互连
DOI：
10.1049/el.2018.6839
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发表时间：
2019
影响因子：
1.1
通讯作者：
Bezuidenhout P
中科院分区：
文献类型：
--
作者：
Bezuidenhout P
这项工作详细介绍了将未封装硅芯片集成到纸基板上的制造工艺，作为构建混合喷墨印刷纸基电路的一部分。刚性元件和柔性基板之间的这种集成有利于低成本应用，并充分利用了成熟的集成电路技术和新兴的纸质电子平台的优势。芯片边缘的强力胶倾斜形成斜坡，用于打印纸基电路和芯片衬垫之间的银互连。比较了两种印刷方案，第一种是单层印刷，滴距为5 μm，第二种是三层印刷，滴距为35 μm。一个未封装的RFID标签芯片成功集成，并提出了概念证明。
This work details manufacturing processes developed to integrate an unpackaged silicon die onto a paper substrate, as part of constructing a hybrid inkjet‐printed paper‐based circuit. This integration between rigid components and flexible substrates is beneficial in low‐cost applications and capitalises on the advantages of both the well‐established integrated circuit technology and the emerging paper‐based electronics platforms. A superglue incline at the chip edge formed a ramp for printing the silver interconnects between the paper‐based circuit and the chip pads. Two printing protocols are compared, the first a single layer using 5 μm drop spacing, and the second using a 35 μm drop spacing for three layers. An unpackaged RFID tag die is successfully integrated and is presented as proof of concept.