Microsolidics: Fabrication of three-dimensional metallic microstructures in poly(dimethylsiloxane)
Microsolidics: Fabrication of three-dimensional metallic microstructures in poly(dimethylsiloxane)
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DOI：
10.1002/adma.200601787
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发表时间：
2007-03-05
影响因子：
29.4
通讯作者：
Whitesides, George M.
中科院分区：
文献类型：
--
作者：
Siegel, Adam C.;Bruzewicz, Derek A.;Whitesides, George M.
演示了通过将液态焊料注入微流体通道并使焊料冷却和固化来制造3D复杂金属微结构;制造后，金属结构可以弯曲，弯曲或扭曲（见图和封面）。通过这种方法，可以构建柔性电子电路，复杂的嵌入式或独立式3D金属微结构，3D电子元件和混合电子微流体设备。
The fabrication of complex metallic microstructures in 3D by injecting liquid solder into microfluidic channels and allowing the solder to cool and solidify is demonstrated; after fabrication, the metallic structures can be flexed, bent, or twisted (see figure and cover). With this method it is possible to build flexible electronic circuits, complex embedded or freestanding 3D metal microstructures, 3D electronic components, and hybrid electronic-microfluidic devices.