Novel pre-treatment process for liberation of metals from waste printed circuit boards using organic solution
Novel pre-treatment process for liberation of metals from waste printed circuit boards using organic solution
复制标题
使用有机溶液从废弃印刷电路板中释放金属的新型预处理工艺
DOI:
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复制
发表时间:
2007
期刊:
影响因子:
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通讯作者:
정진기
中科院分区:
文献类型:
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作者:
쿠마르 자 마니스;유재민;이재천;정진기
A method for collecting metal from the wasted printed circuit board using the organic solution is provided to raise the recovery rate of metal by pretreating the wasted printed circuit board using the organic solvent. The cut wasted printed circuit board is put into in the organic solvent. The organic solvent is the N, N-Dimethylformamide, the methyl ethyl ketone, Tetrahydrofuran, Stripoxy or their mixture. The metal and plastic are selected by mixing the wasted printed circuit board. The separated metal and plastic are separated from the organic solution by using sieve. The separated metal and plastic mixture are washed and dried.