Assessing bacterial recovery and efficacy of cold atmospheric plasma treatments
Assessing bacterial recovery and efficacy of cold atmospheric plasma treatments
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DOI：
10.1016/j.fbp.2015.07.011
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发表时间：
2015-10-01
影响因子：
4.6
通讯作者：
Valdramidis, V. P.
中科院分区：
文献类型：
--
作者：
Millan-Sango, D.;Han, L.;Valdramidis, V. P.
冷常压等离子体（CAP）是一种非热净化技术，能够产生抗菌剂组，包括；光子、电子、带正电荷和负电荷的离子、原子、自由基和受激或未受激的分子。在不同时间（即15、30、60、90 s）进行CAP处理（70 kV, 50 Hz），分别接种大肠杆菌NCTC 12900、大肠杆菌ME 9062或大肠杆菌soxS、rpoS和dnaK基因敲除突变体的肉汤体系。光学发射光谱分析表明，CAP处理产生的主要抗菌活性物质为N-2、N2+、NO、h - α和He。处理后，所研究细菌的减少水平高达0.5 log CFU/mL，无统计学差异。采用2倍稀释法计算了动力学生长参数。嗯。，随着CAP处理时间的延长，所有细菌的细菌数量均有所下降。E. coil dnaK是对血浆最敏感的突变体，在CAP作用60s和90s后没有恢复。另外，对接种了E. coil NCTC 12900的黄油头生菜进行了CAP攻毒试验处理，CAP 60和90处理可使细菌水平降低1.5 log CFU/cm(2)以上。(C) 2015化学工程师学会。Elsevier BM出版。版权所有。
Cold atmospheric plasma (CAP) is a non-thermal decontamination technology capable of generating groups of antimicrobial agents including; photons, electrons, positively and negatively charged ions, atoms, free radicals and excited or non-excited molecules. CAP treatments (70 kV, 50 Hz) at different times (i.e. 15, 30, 60, 90 s) were applied to a broth system inoculated either with Escherichia coil NCTC 12900, E. coli ME 9062 or E. coli knockout mutants of soxS, rpoS and dnaK genes. Optical emission spectra were performed and the main antimicrobial reactive substances generated by CAP treatments were found to be N-2, N2+, NO, H-alpha and He. After treatments, reduction levels of the studied bacteria were up to 0.5 log CFU/mL, no showing statistical diffeiences. Moreover, the kinetic growth parameters were calculated by applying the 2-fold dilution method. um., decreased in all bacteria when the time of CAP treatment increased. E. coil dnaK was the most sensitive mutant to plasma, showing no recovery after CAP of 60 and 90 s. In addition, CAP challenge test treatments were applied on butter head lettuce inoculated with E. coil NCTC 12900 with CAP treatments of 60 and 90s reducing bacteria levels by more than 1.5 log CFU/cm(2). (C) 2015 The Institution of Chemical Engineers. Published by Elsevier BM. All rights reserved.