Development of a hardware-In-the-Loop (HIL) testbed for cyber-physical security in smart buildings
Development of a hardware-In-the-Loop (HIL) testbed for cyber-physical security in smart buildings
复制标题
开发智能建筑网络物理安全的硬件在环 (HIL) 测试台
DOI:
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发表时间:
2022
期刊:
影响因子:
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通讯作者:
C. Parikh
中科院分区:
文献类型:
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作者:
Guowen Li;Z. Yang;Yangyang Fu;Lingyu Ren;Zheng O’Neill;C. Parikh
As smart buildings move towards open communication technologies, providing access to the Building Automation System (BAS) through the intranet, or even remotely through the Internet, has become a common practice. However, BAS was historically developed as a closed environment and designed with limited cyber-security considerations. Thus, smart buildings are vulnerable to cyber-attacks with the increased accessibility. This study introduces the development and capability of a Hardware-in-the-Loop (HIL) testbed for testing and evaluating the cyber-physical security of typical BASs in smart buildings. The testbed consists of three subsystems: (1) a real-time HIL emulator simulating the behavior of a virtual building as well as the Heating, Ventilation, and Air Conditioning (HVAC) equipment via a dynamic simulation in Modelica; (2) a set of real HVAC controllers monitoring the virtual building operation and providing local control signals to control HVAC equipment in the HIL emulator; and (3) a BAS server along with a web-based service for users to fully access the schedule, setpoints, trends, alarms, and other control functions of the HVAC controllers remotely through the BACnet network. The server generates rule-based setpoints to local HVAC controllers. Based on these three subsystems, the HIL testbed supports attack/fault-free and attack/fault-injection experiments at various levels of the building system. The resulting test data can be used to inform the building community and support the cyber-physical security technology transfer to the building industry.
影响因子:
9.4
作者:
Li, Guowen;Ren, Lingyu;Fu, Yangyang;Yang, Zhiyao;Adetola, Veronica;Wen, Jin;Zhu, Qi;Wu, Teresa;Candan, K.Selcuk;O'Neill, Zheng
通讯作者:
O'Neill, Zheng