Projection ablation of glass-based single and arrayed microstructures using excimer laser
Projection ablation of glass-based single and arrayed microstructures using excimer laser
复制标题
使用准分子激光投影烧蚀玻璃基单一和阵列微结构
DOI：
10.1016/j.optlastec.2004.04.007
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发表时间：
2005
影响因子：
5
通讯作者：
Ping
中科院分区：
文献类型：
--
作者：
Ying;K. Ma;A. Tseng;Ping
研究了用准分子激光烧蚀单个微结构和阵列微结构。单特征微结构的制作用于评估烧蚀机制，阈值通量，和相关的材料去除（烧蚀）率。烧蚀过程中的形态变化进行了研究，重点是烧蚀缺陷，碎片或重铸的形成。消除这些缺陷的可能性也进行了评估和论证。本研究集中在硼硅酸盐玻璃，虽然聚酰亚胺和硅烧蚀进行了比较和讨论。聚酰亚胺和硅是电子工业中最常用的聚合物或半导体材料。烧蚀阵列的微结构，以证明这样的事实，即通过重复与同步的激光脉冲和基板移动，阵列和更复杂的结构可以成本有效地制造相关联的简单图案化的掩模。这些阵列微结构的潜在应用进行了讨论和说明。提出了一种低成本的复制技术，即利用目前加工的阵列微结构作为电铸镍微针的成型模具。最后，对准分子激光在玻璃基结构微加工中的应用前景进行了展望。
Ablation of single and arrayed microstructures using an excimer laser is studied. The single feature microstructures are fabricated for evaluating the ablation mechanism, threshold fluence, and associated material removing (ablation) rate. The morphology changes during ablation are investigated with the focus on the formation of the ablation defects, debris or recast. The possibility of removing these defects is also evaluated and demonstrated. The present study concentrates on the borosilicate glass, although ablation of polyimide and silicon are performed and discussed for comparison. Polyimide and silicon are the most popular polymer or semiconductor material used in the electronics industry. The arrayed microstructures are ablated to demonstrate the fact that, by repetition of a simple-patterned mask associated with synchronized laser pulses and substrate movement, arrayed and more complex structures can be cost-effectively manufactured. The potential applications of these arrayed microstructures are discussed and illustrated. A low-cost replication technique that uses the arrayed microstructure presently machined as the forming mold for making electroforming nickel microneedles is specifically presented. Finally, the potential areas of using excimer laser in micromachining of glass-based structures for future research are also briefly covered.