FEM Analysis of Thermal Cycle Properties of the Substrates for Power Modules
FEM Analysis of Thermal Cycle Properties of the Substrates for Power Modules
复制标题
功率模块基板热循环特性的有限元分析
DOI：
10.5104/jiep.3.330
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发表时间：
2000
影响因子：
--
通讯作者：
S. Shimamura
中科院分区：
文献类型：
--
作者：
Yoshiyuki Nagatomo;T. Nagase;S. Shimamura
采用有限元分析方法研究了铜和铝电路基板的热循环性能。铜电路基板的AlN中的热应力大于铝电路基板，并且随着热循环的进行而增加。将Si芯片接合在Cu电路基板上的焊料中的Mises应变大于Al电路基板，并且估计Al电路基板上的焊料的疲劳寿命比Cu电路基板长约1400个循环。这些结果是由于Cu和Al的加工硬化速率的差异。Cu和Al电路在热循环期间具有塑性变形，因此，Cu由于其大的加工硬化而变得更硬。另一方面，由于Al的加工硬化速率远小于Cu，因此Al的流动应力不会随着热循环而增加。有人认为，使用铜降低了电源模块的可靠性。
We investigated the thermal cycle properties of Cu and Al circuit substrates using FEM analysis. The thermal stress in AIN for the Cu circuit substrate is larger than the Al circuit substrate and it increases as the thermal cycling proceeds. The Mises strain in the solder which joins the Si chip on the Cu circuit substrate is larger than the Al circuit substrate, and the fatigue life of the solder on the Al circuit substrate is estimated to be about 1400 cycles longer than the Cu circuit substrate. These results are due to the difference of the work hardening rate of Cu and Al. Cu and Al circuits have a plastic deformation during the thermal cycling, thus, Cu becomes harder due to its large work hardening. On the other hand, since the work hardening rate of Al is much less than Cu, the flow stress of Al does not increase with thermal cycling. It is suggested that using Cu lowers the reliability of power modules.