PCB의 ENIG와 OSP 표면처리에 따른 Sn-3.5Ag 무연솔더 접합부의 Electromigration 특성 및 전단강도 평가
PCB의 ENIG와 OSP 표면처리에 따른 Sn-3.5Ag 무연솔더 접합부의 Electromigration 특성 및 전단강도 평가
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PCB ENIG OSP Sn-3.5Ag 电迁移
DOI：
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发表时间：
2014
期刊：
影响因子：
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通讯作者：
박영배
中科院分区：
文献类型：
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作者：
김성혁;이병록;김재명;유세훈;박영배
系统研究了印刷电路板化学镀镍浸金（ENIG）和有机可焊性保护剂（OSP）表面处理对Sn-3.5Ag无铅焊料凸点电迁移可靠性和剪切强度的影响。在扫描电子显微镜室中在130、150和170 ℃下进行原位退火测试，以研究金属间化合物（IMC）的生长动力学。在150 ℃和1.5× 105 A/cm 2下研究了电迁移寿命和失效模式，在10 ~ 3000 mm/s的高速条件下进行了球剪切试验和失效模式分析。退火过程中的ENIG和OSP表面光洁度的活化能分别为0.84 eV和0.94 eV。具有ENIG表面光洁度的焊料凸点显示出比OSP表面光洁度更长的电迁移寿命。ENIG和OSP之间的剪切强度相似，剪切能随着剪切速度的增加而降低。失效分析表明，界面IMC的稳定性与电气和机械可靠性密切相关。
The effects of printed circuit board electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) surface finishes on the electromigration reliability and shear strength of Sn-3.5Ag Pb-free solder bump were systematically investigated. In-situ annealing tests were performed in a scanning electron microscope chamber at 130, 150, and 170˚C in order to investigate the growth kinetics of intermetallic compound (IMC). Electromigration lifetime and failure modes were investigated at 150˚C and 1.5×105A/cm2, while ball shear tests and failure mode analysis were conducted under the high-speed conditions from 10 mm/s to 3000 mm/s. The activation energy of ENIG and OSP surface finishes during annealing were evaluated as 0.84 eV and 0.94 eV, respectively. The solder bumps with ENIG surface finish showed longer electromigration lifetime than OSP surface finish. Shear strengths between ENIG and OSP were similar, and the shear energies decreased with increasing shear speed. Failure analysis showed that electrical and mechanical reliabilities were very closely related to the interfacial IMC stabilities.