Parametric modeling and performance analysis of a personalized insole based on 3D scanning and selective laser sintering

Parametric modeling and performance analysis of a personalized insole based on 3D scanning and selective laser sintering
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基于 3D 扫描和选择性激光烧结的个性化鞋垫参数化建模和性能分析

DOI:
10.1080/0951192x.2020.1815849
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发表时间:
2020-09
影响因子:
4.1
通讯作者:
Yan Ran
Yan Ran
中科院分区:
工程技术3区
文献类型:
--
作者:
Li Junchao;Shu Wenhao;Yang Yanan;Yan Ran

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摘要目前的个性化鞋垫设计方法存在着重复劳动多、过于依赖经验的问题。为了解决这些问题,本研究将参数化建模和选择性激光烧结(SLS)相结合,以自动生成个性化鞋垫。首先利用三维扫描技术实现人体足部模型的建立,然后基于草蜢软件开发了一个具有自动绘制线条模块的参数化建模程序。此外,还利用SLS技术制造了个性化鞋垫和平底鞋垫,并利用有限元分析和FootScan系统对其性能进行了评估。结果表明,与传统的鞋垫设计方法相比,所提出的个性化鞋垫参数化设计方法大大减少了工作量,并且可以方便地调整鞋垫设计以获得令人满意的足部舒适性。利用SLS技术可以成功地制造出具有复杂阵列结构的定制化鞋垫。此外,与平底相比,个性化鞋垫可以降低30%的峰值接触压力,提高鞋垫的强度和耐用性,这主要归功于脚部贴合表面和采用的阵列结构。文中还讨论了结合SLS技术的参数化建模方法的优点和潜在应用。
ABSTRACT Current design methods of individualized insoles are confronted with much-repeated work and are over-reliance on experiences. To tackle these problems, parametric modeling and selective laser sintering (SLS) were integrated for automatically generating personalized insoles in this study. 3D scanning was first used to achieve an individual’s foot model and then an innovative parametric modeling program with an automatic line drawing module based on Grasshopper was developed. Additionally, both personalized insoles and flat insoles were manufactured via SLS technology and their performances were evaluated with finite element analysis and a Footscan system. The results show that the proposed parametric method of individualized insoles largely reduces the workload in comparison to traditional design, and can conveniently regulate the insole design for agreeable foot comfort. And the developed customized insoles with complex array structure can be successfully manufactured with SLS technology. Additionally, the personalized insole can reduce the peak contact pressure by 30% compared with the flat insole, and increase the strength and the durability of the insole, which is mainly attributed to the foot-fitting surface and the adopted array structure. The advantages and potential applications of the proposed parametric modeling method coupled with SLS technology were also discussed.
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