7.2.3 Thermal/Acoustic trade‐off design for Consumer Electronics in a distributed design environment
7.2.3 Thermal/Acoustic trade‐off design for Consumer Electronics in a distributed design environment
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7.2.3 分布式设计环境中消费电子产品的热/声学权衡设计
DOI：
10.1002/j.2334-5837.2009.tb01006.x
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发表时间：
2009
期刊：
影响因子：
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通讯作者：
L. Balmelli
中科院分区：
文献类型：
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作者：
Kenichi Seki;H. Nishimura;K. Ishii;L. Balmelli
当今市场对更小、更强大的消费电子产品的需求对产品的快速设计提出了重大挑战。此外，企业内部不同利益相关者之间进行战略协调的能力日益成为实现全球工程的重要标准。本文首先介绍了涉及分布式设计团队的典型设计过程，特别是该过程允许在流速和声辐射阻力方面对腔体（即外壳内的空气空间）进行热声设计。然后我们继续研究一种利用最新建模技术来有效支持这一过程的方法。该过程利用系统建模语言（SysML.）作为产品描述支持，并使用设计结构矩阵作为分析设计工具。我们使用模型和 DSM 作为驱动数值模拟和进行权衡研究的手段。仿真结果表明，在早期系统设计阶段进行权衡研究可为所研究的问题带来潜在的最佳模块布局。
Today's market demand for smaller, more powerful consumer electronics poses a major challenge to the rapid design of products. In addition, the ability to perform strategic coordination amongst different stakeholders within the enterprise increasingly becomes an important criterion to enable global engineering. We begin the paper with an introduction to a typical design process involving distributed design teams In particular the process allows the thermal‐acoustic design of cavities, i.e. air space inside the enclosure, in terms of flow rate and acoustic radiation resistance. Then we proceed with the investigation of an approach leveraging recent modelling technology to support such a process efficiently. The process makes use of the system modelling language (SysML.) as product description support and the Design Structure Matrix as an analytical design tool. We use the model and the DSM as a means to drive numerical simulation and perform trade‐off studies. Simulation results show that performing trade‐off study in the early system design phase leads to a potentially optimal module layout for the problem studied.
DOI：
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发表时间：
2006
期刊：
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影响因子：
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作者：
Jonas Detterfelt;Gert Johansson
通讯作者：
Jonas Detterfelt;Gert Johansson