Towards the simulation of grinding processes – a thermoplastic single grain approach
Towards the simulation of grinding processes – a thermoplastic single grain approach
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走向模拟研磨过程——热塑性单晶粒方法
DOI：
10.1002/pamm.201110184
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发表时间：
2011
期刊：
影响因子：
--
通讯作者：
B. Svendsen
中科院分区：
文献类型：
--
作者：
R. Holtermann;A. Menzel;C. Hortig;B. Svendsen
目前的工作旨在对金属磨削过程进行建模和仿真，重点关注工具和工件相互作用产生的热行为。从单个晶粒的二维模型开始，根据晶粒几何形状的变化及其相对于工件的空间位置进行代表性数值实验，以预测由此产生的载荷位移行为。
The current work aims at the modelling and simulation of metal grinding processes with focus on the thermal behaviour resulting from the interaction of tool and workpiece. Starting from a two‐dimensional model of a single grain, representative numerical experiments are carried out based on the variation of grain geometry and its spatial position relative to the workpiece to predict the resulting load‐displacement‐behaviour.