Preparation and Characterization of Electroless Deposited Fe-Ni-B Alloy Films
Preparation and Characterization of Electroless Deposited Fe-Ni-B Alloy Films
复制标题
化学沉积Fe-Ni-B合金薄膜的制备与表征
DOI：
10.1149/08907.0053ecst
复制
发表时间：
2019
期刊：
影响因子：
--
通讯作者：
Nakamura Toshihiro
中科院分区：
文献类型：
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作者：
Yamamoto Takayo;Nagayama Tomio;Konno Yoshiki;Okura Kaname;Nakamura Toshihiro
采用化学镀方法制备了铁镍硼(Fe-Ni-B)合金薄膜。对它们的应力产生、热应力、热膨胀和晶体结构进行了评价。热膨胀系数的变化与薄膜的晶体结构有关，与薄膜中的Fe/Ni比有关，薄膜的微观结构和晶粒度随硼含量的不同而不同。薄膜的微观结构和颗粒尺寸影响薄膜形成时产生的应力。另外，热膨胀系数的大小和加热时晶体结构的变化对热应力也有影响。Fe含量在55~63wt%的因瓦合金薄膜的热膨胀系数和初始内应力均低于富镍的Fe-Ni-B合金薄膜，加热后组织无明显变化。因此，化学沉积因瓦Fe-Ni-B合金膜可用作具有高热适性的金属化薄膜，用于可靠的高密度封装。
We prepared iron–nickel–boron (Fe–Ni–B) alloy thin films using the electroless plating method. Their stress generation, thermalstress, thermal-expansion, and crystal structure were evaluated. Changes in the coefficients of thermal expansion (CTEs), related to the crystal structure, depended on the Fe/Ni ratio in the obtained films, and the microstructure and grain size differed depending on the boron content. The microstructures and grain sizes affected the stress generated by film formation. In addition, the CTE values and change of crystal structure upon heating affected the thermal stress. These Fe–Ni–B alloy films in the Invar composition range with 55–63 wt% Fe contents showed lower CTE values and initial internal stress than those of Ni-rich Fe–Ni–B alloy films, and no structural change upon heating. Thus, an electroless deposited Invar Fe–Ni–B alloy film can be used as metallized films with high thermal suitability for reliable high-density packaging.