In-situ X-ray diffraction study of the initial dealloying of Cu3Au(001) and Cu0.83Pd0.17(001)
In-situ X-ray diffraction study of the initial dealloying of Cu3Au(001) and Cu0.83Pd0.17(001)
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DOI：
10.1016/j.tsf.2006.12.003
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发表时间：
2007-05
期刊：
影响因子：
2.1
通讯作者：
F. Renner;Y. Gründer;P. Lyman;J. Zegenhagen
中科院分区：
文献类型：
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作者：
F. Renner;Y. Gründer;P. Lyman;J. Zegenhagen
脱合金和选择性溶解是严重的腐蚀过程，但也在技术中使用。本文研究了Cu{sub 0.83}Pd{sub 0.17}（001）和Cu{sub 3}Au（001）在0.1 M H{sub 2}SO{sub 4}（pH = 1）电解液中，在低于临界电位下原位电化学选择性溶解Cu时的表面结构。在这两种情况下，我们观察到的原始合金（Au或Pd）的贵组分的纳米级岛的外延层的形成。这些岛形成抑制Cu大量溶解的金属钝化层。Au岛形成{l_brace}111{r_brace}面。通过将Cu离子从电解质溶液再沉积到Pd岛上，形成外延Cu层。
Dealloying and selective dissolution are serious corrosion processes, but also employed in technology. We studied the surface structure of Cu{sub 0.83}Pd{sub 0.17}(001) and Cu{sub 3}Au(001) during electrochemical selective Cu dissolution below the critical potential in-situ in 0.1 M H{sub 2}SO{sub 4} (pH = 1) electrolyte. In both cases we observe the formation of an epitaxial layer of nano-scale islands of the noble component of the original alloy (Au or Pd). These islands form a metallic passivation layer suppressing massive dissolution of Cu. The Au islands developed {l_brace}111{r_brace} facets. By re-deposition of Cu ions from the electrolyte solution onto Pd islands, an epitaxial Cu layer is formed.