Ductile and Brittle Mode Grinding of Fused Silica
Ductile and Brittle Mode Grinding of Fused Silica
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DOI：
10.4028/www.scientific.net/kem.447-448.21
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发表时间：
2010-09
期刊：
影响因子：
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通讯作者：
Peng Yao;N. Yoshihara;N. Hitomi;Jixin Yan;T. Kuriyagawa
中科院分区：
文献类型：
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作者：
Peng Yao;N. Yoshihara;N. Hitomi;Jixin Yan;T. Kuriyagawa
存在对熔融石英的高效率和高表面完整性研磨的需求。韧性磨削是在硬脆材料上生产镜面抛光表面的理想方法，可显著缩短抛光时间。然而，熔融石英仍然很难延性研磨，因为它的高脆性。采用缓进给锥度磨削方法研究了熔融石英陶瓷的最大磨粒切削深度与表面完整性的关系。在熔融石英上实现了延性模式磨削。当切削深度超过临界砂轮切削深度时，表面突然从韧性模式变为脆性模式。在砂轮转速与工作台转速比相同的情况下，提高砂轮转速可显著提高临界切深，从而导致磨粒与工件界面温度升高。通过抛光试验研究了亚表面损伤的深度。实验结果表明，相变模式下的SSD深度最深，而脆性模式下的SSD深度较稳定。
There is a demand for high-efficiency and high surface integrity grinding of fused silica. Ductile grinding is an ideal method for producing a mirror finished surface on hard and brittle materials to significantly decrease polishing time. However, the fused silica is still difficult to ductile grind because of its high brittleness. A creep feed taper grinding method was applied to investigate the relationship between maximum grit depth of cut and surface integrity of fused silica. Ductile mode grinding was achieved on fused silica. When the depth of cut exceeds the critical wheel depth of cut, the surface suddenly changes from the ductile mode to the brittle mode. At the same ratio of wheel speed and table speed, the critical wheel depth of cut is noticeably increased by increasing the wheel speed which caused an increase in the temperature at the interface of grains and workpiece. The depth of subsurface damage (SSD) was investigated by polishing the ground surface. The experiment results show that the depth of SSD is deepest in transition mode and stables in brittle mode.