Effect of Sn nanoparticle additions on thermal properties of Sn-Ag-Cu lead-free solder paste
Effect of Sn nanoparticle additions on thermal properties of Sn-Ag-Cu lead-free solder paste
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DOI：
10.1016/j.tca.2020.178642
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发表时间：
2020-08-01
影响因子：
3.5
通讯作者：
Gu, Zhiyong
中科院分区：
文献类型：
--
作者：
Wernicki, Evan;Gu, Zhiyong
采用Sn-3Ag-0.5Cu（SAC 305）微焊料、1- 5wt%的Sn纳米颗粒和助焊剂制备无铅纳米复合焊膏。采用差示扫描量热法（DSC）研究了纳米复合材料浆料，以了解其热性能和不同尺寸的粉末之间的相互作用。DSC测量结果表明，在所有纳米复合材料与锡纳米粒子添加膏两个不同的吸热峰，与一个峰归因于SAC微粉的熔融和另一个峰的熔融的锡纳米粒子。随着Sn纳米颗粒添加量的增加，SAC材料由于其大的质量分数而在其熔融温度上显示出很小的变化。纳米复合材料焊膏的多循环DSC测量显示出额外的吸热峰，表明SAC 305微焊料粉末和纯Sn纳米颗粒可能彼此相互作用以形成额外的合金。从DSC测量的熔融焓的变化也被用来分析的纳米复合材料糊的熔融特性。此外，热重分析（TGA）表明，更多的重量被保留的纳米复合材料焊膏与增加锡纳米粒子添加，相比，基线SAC焊膏。
Lead-free nanocomposite solder pastes were prepared with Sn-3Ag-0.5Cu (SAC 305) microsolders, 1-5 wt% Sn nanoparticles, and a flux. The nanocomposite pastes were studied using differential scanning calorimetry (DSC) to understand their thermal properties and the interactions between the different sized powders. DSC measurements showed two distinct endothermic peaks in all nanocomposite pastes with Sn nanoparticle additions, with one peak attributing to the melting of SAC micropowders and another peak to the melting of Sn nanoparticles. With the increased amount of Sn nanoparticle additions, the SAC material showed little change in its melting temperatures due to its large mass fraction. Multi-cycle DSC measurements of the nanocomposite solder pastes showed additional endothermic peaks, suggesting that the SAC 305 microsolder powders and pure Sn nanoparticles may have interacted with each other to form additional alloys. Changes in enthalpy of melting from DSC measurements were also used to analyze the melting characteristics of the nanocomposite pastes. Additionally, thermogravimetric analysis (TGA) showed that more weight was retained for the nanocomposite solder pastes with increasing Sn nanoparticle additions, compared to the baseline SAC solder paste.