The Tofu Interconnect D
The Tofu Interconnect D
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豆腐互联 D
DOI：
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发表时间：
2018
期刊：
影响因子：
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通讯作者：
Tomohiro Inoue
中科院分区：
文献类型：
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作者：
Yuichiro Ajima;Takahiro Kawashima;Takayuki Okamoto;Naoyuki Shida;Kouichi Hirai;T. Shimizu;S. Hiramoto;Yoshiro Ikeda;T. Yoshikawa;Kenji Uchida;Tomohiro Inoue
在本文中，我们引入了一个新的且高度可扩展的互连，称为豆腐互连D，该机器将在2021年左右正式运行。在本文中，“双轨”转移。 tofu2的光学链接比例。 tofu2的注射速率为38.1 GB/s，约为tofu2注射率的83％。
In this paper, we introduce a new and highly scalable interconnect called Tofu interconnect D that will be used in the post-K machine. This machine will officially be operational around 2021. The letter D represents high “density” node and “dynamic” packet slicing for “dual-rail” transfer. Herein we describe the design and the evaluation results of TofuD. Due to the high-density packaging, the optical link ratio of TofuD has decreased to 25% from the 66% optical link ratio of Tofu2. TofuD applies a new technique called dynamic packet slicing to reduce latency and to improve fault resilience. The evaluation results show that the one-way 8-byte Put latency is 0.49 μs. This is 31% lower than the latency of Tofu2. The injection rate per node is 38.1 GB/s which is approximately 83% of the injection rate of Tofu2. The link efficiency is as high as approximately 93%.