Palladium-silver composite membranes by electroless plating technique
Palladium-silver composite membranes by electroless plating technique
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DOI：
10.1016/s0376-7388(99)00009-5
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发表时间：
1999-06
影响因子：
9.5
通讯作者：
Y. Cheng;K. Yeung
中科院分区：
文献类型：
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作者：
Y. Cheng;K. Yeung
在含钯和银前驱体的肼基镀液中，确定了沉积纯钯和纯银膜以及同时共沉积钯和银的确切条件。测定了从混合镀液中共沉积钯和银的化学镀动力学。建立了一个数学模型来预测镀膜厚度、镀速和成分分布随镀膜参数(即反应物浓度和时间)的变化。还研究了化学镀过程中薄膜组织和成分的变化。氢渗透研究表明，与相同厚度的纯钯膜相比，Pd-Ag合金膜具有优越的性能。此外，单相合金的形成大大提高了氢的渗透速率。
The exact conditions for deposition of pure palladium and pure silver membranes as well as simultaneous, co-deposition of palladium and silver have been identified for a hydrazine-based plating bath containing both palladium and silver precursors. The electroless plating kinetics have been determined for co-deposition of palladium and silver from the mixed plating bath. A mathematical model has been developed to predict the film thickness, plating rate and composition profile as a function of plating parameters (i.e., reactant concentrations and time). The evolution of the microstructure and composition of the film during electroless plating has also been investigated. A hydrogen permeation study has demonstrated that the Pd–Ag alloy membrane has superior performance compared to a pure palladium membrane of similar thickness. In addition, the formation of a single-phase alloy results in substantial enhancement in the hydrogen permeation rate.